US 12,221,696 B2
Process kits and related methods for processing chambers to facilitate deposition process adjustability
Zhepeng Cong, San Jose, CA (US); Ala Moradian, Sunnyvale, CA (US); Tao Sheng, Santa Clara, CA (US); Nimrod Smith, Cupertino, CA (US); Ashur J. Atanos, San Jose, CA (US); and Vinh N. Tran, San Jose, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 22, 2022, as Appl. No. 17/871,607.
Claims priority of provisional application 63/346,681, filed on May 27, 2022.
Prior Publication US 2023/0407478 A1, Dec. 21, 2023
Int. Cl. C23C 16/458 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01)
CPC C23C 16/458 (2013.01) [C23C 16/4405 (2013.01); C23C 16/4408 (2013.01); H01J 37/32477 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A process kit for disposition in a processing chamber applicable for use in semiconductor manufacturing, the process kit comprising:
a plate having a first face and a second face opposing the first face;
an upper liner comprising:
an annular section,
one or more ledges extending inwardly relative to the annular section, the one or more ledges configured to support one or more outer regions of the second face of the plate,
one or more inlet openings extending to an inner surface of the annular section on a first side of the upper liner, and
one or more outlet openings extending to the inner surface of the annular section on a second side of the upper liner,
the second face of the plate is positionable to face a substrate support, and the plate is sized to span a gap extending inwardly of the one or more ledges to divide an internal volume into an upper portion and a lower portion; and
a lower liner configured for positioning below the upper liner.