US 12,221,694 B2
Conditioning of a processing chamber
Pramit Manna, Sunnyvale, CA (US); Swaminathan T. Srinivasan, Pleasanton, CA (US); and Timothy J. Franklin, Campbell, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 14, 2019, as Appl. No. 16/601,400.
Claims priority of provisional application 62/745,576, filed on Oct. 15, 2018.
Prior Publication US 2020/0115795 A1, Apr. 16, 2020
Int. Cl. C23C 16/44 (2006.01); B08B 9/032 (2006.01); C23C 16/455 (2006.01); C23C 16/505 (2006.01); H01J 37/32 (2006.01)
CPC C23C 16/4405 (2013.01) [B08B 9/0321 (2013.01); C23C 16/4404 (2013.01); C23C 16/45565 (2013.01); C23C 16/505 (2013.01); H01J 37/32082 (2013.01); H01J 37/32449 (2013.01); H01J 37/32862 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for cleaning one or more interior surfaces of a processing chamber, the method comprising:
introducing a first cleaning chemistry comprising at least one of steam, chlorine, hydrochloride, or plasma into the processing chamber to generate a first internal pressure of about 1.5 atm to about 10 atm during a first cleaning period within the processing chamber and remove deposited contaminants from one or more interior surfaces of the processing chamber;
removing the first cleaning chemistry from the processing chamber; and
generating a second internal pressure within the processing chamber during a second cleaning period, wherein the second cleaning period is subsequent to the first cleaning period, and wherein the second internal pressure is 1 atm or less, and wherein generating the second internal pressure within the processing chamber comprises introducing a second cleaning chemistry different than the first cleaning chemistry into the processing chamber.