US 12,221,569 B2
Adhesive tape for semiconductor package manufacturing process, and method for manufacturing same
Byeong Yeon Choi, Gyeonggi-do (KR); Seung Yol Lee, Gyeonggi-do (KR); Suk Hee Kang, Gyeonggi-do (KR); and Gyung Ju Yoon, Gyeonggi-do (KR)
Assigned to MODU TECH CO., LTD., Gyeonggi-do (KR)
Appl. No. 17/440,049
Filed by MODU TECH CO., LTD., Gyeonggi-do (KR)
PCT Filed Oct. 30, 2019, PCT No. PCT/KR2019/014463
§ 371(c)(1), (2) Date Nov. 4, 2021,
PCT Pub. No. WO2020/189873, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 10-2019-0030488 (KR), filed on Mar. 18, 2019; application No. 10-2019-0070137 (KR), filed on Jun. 13, 2019; and application No. 10-2019-0119666 (KR), filed on Sep. 27, 2019.
Prior Publication US 2022/0220345 A1, Jul. 14, 2022
Int. Cl. C09J 7/29 (2018.01); C09J 7/30 (2018.01); C09J 7/40 (2018.01); C09J 7/50 (2018.01); C09J 183/06 (2006.01); H01L 23/482 (2006.01)
CPC C09J 7/29 (2018.01) [C09J 7/30 (2018.01); C09J 7/40 (2018.01); C09J 7/50 (2018.01); C09J 183/06 (2013.01); H01L 23/4827 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2483/00 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An adhesive tape for a semiconductor package manufacturing process, which is configured to be attached to a semiconductor package bottom surface having a plurality of protruding electrodes formed thereon, the adhesive tape comprising:
a first adhesive layer formed on a first base film;
a second base film formed on the first adhesive layer, in which the second base film changes its shape to conform to a topology of the semiconductor package bottom surface when the adhesive tape is attached to the semiconductor package bottom surface, and the second base film contains a metal element so as to independently maintain the changed shape during the process; and
a second adhesive layer formed on the second base film, the second adhesive layer having a smaller thickness than the first adhesive layer and having a lower adhesive strength than the first adhesive layer,
wherein each of the first adhesive layer and the second adhesive layer has a spiral network molecular structure and comprises a first adhesive composition containing silicone, and
wherein the adhesive type further comprises a fluorine-containing release film attached onto the second adhesive layer, wherein the release film has an adhesive strength ranging from 3 gf/25 mm to 8 gf/25 mm.