US 12,221,565 B2
Bonded structure
Hirotaka Miyano, Kariya (JP); Masami Saito, Kariya (JP); Kazuhiro Morita, Kariya (JP); Taiga Handa, Morioka (JP); Katsuhito Mori, Morioka (JP); and Kunio Mori, Morioka (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Sep. 20, 2022, as Appl. No. 17/948,318.
Claims priority of application No. 2021-154165 (JP), filed on Sep. 22, 2021.
Prior Publication US 2023/0098430 A1, Mar. 30, 2023
Int. Cl. C09J 5/04 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01)
CPC C09J 5/04 (2013.01) [B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 9/045 (2013.01); B32B 15/20 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); C09J 2301/208 (2020.08); C09J 2301/312 (2020.08)] 10 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a first bonded member having a first bonding surface;
a second bonded member having a second bonding surface; and
a bonding layer that bonds the first bonding surface and the second bonding surface, wherein
the bonding layer includes:
a stress relaxation layer containing a chain polymer;
a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface; and
a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface,
a first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule,
a second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule, and
a third linear expansion coefficient of the first bonded member differs from a fourth linear expansion coefficient of the second bonded member by one or more orders of magnitude.
 
9. A bonded structure comprising:
a first bonded member having a first bonding surface;
a second bonded member having a second bonding surface; and
a bonding layer that bonds the first bonding surface and the second bonding surface, wherein
the bonding layer includes:
a stress relaxation layer containing a chain polymer;
a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface; and
a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface,
a first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule,
a second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule, and
the bonding layer has a Young's modulus of 0.005 MPa or more and 1 MPa or less.
 
10. A bonded structure comprising:
a first bonded member having a first bonding surface;
a second bonded member having a second bonding surface; and
a bonding layer that bonds the first bonding surface and the second bonding surface, wherein
the bonding layer includes:
a stress relaxation layer containing a chain polymer;
a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface; and
a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface,
a first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule,
a second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule, and
the bonding layer has an elongation of 1 μm/μm or more and 100 μm/μm or less.