	US 12,221,557 B2
	Polishing composition and polishing method
Daiki Ito, Kiyosu (JP); and Toshio Shinoda, Kiyosu (JP)
Assigned to FUJIMI INCORPORATED, Kiyosu (JP)
Filed by FUJIMI INCORPORATED, Kiyosu (JP)
Filed on Feb. 24, 2022, as Appl. No. 17/679,415.
Claims priority of application No. 2021-30021 (JP), filed on Feb. 26, 2021.
Prior Publication US 2022/0275246 A1, Sep. 1, 2022
Int. Cl. C09G 1/02 (2006.01); C09G 1/18 (2006.01); H01L 21/306 (2006.01)

CPC C09G 1/02 (2013.01) [C09G 1/18 (2013.01); H01L 21/30625 (2013.01)]

14 Claims

1. A polishing composition comprising:

abrasives having a positive zeta potential; and

a cyclic compound having a mother nucleus with a ring structure and three or more anionic functional groups bonded to the mother nucleus, wherein

the abrasives contain silica.