US 12,221,556 B2
Hard-mask forming composition, method for manufacturing electronic component, and compound and resin
Keiichi Ibata, Kawasaki (JP)
Assigned to TOKYO OHKA KOGYO CO., LTD., Kawasaki (JP)
Filed by TOKYO OHKA KOGYO CO., LTD., Kawasaki (JP)
Filed on Nov. 17, 2020, as Appl. No. 16/950,614.
Claims priority of application No. 2019-211731 (JP), filed on Nov. 22, 2019.
Prior Publication US 2021/0155825 A1, May 27, 2021
Int. Cl. C09D 179/04 (2006.01); C07C 225/22 (2006.01); C07D 209/86 (2006.01); C07D 209/90 (2006.01); C08G 73/02 (2006.01); C08G 73/06 (2006.01); C09D 179/02 (2006.01); G03F 7/09 (2006.01); H01L 21/027 (2006.01)
CPC C09D 179/04 (2013.01) [C07C 225/22 (2013.01); C07D 209/86 (2013.01); C07D 209/90 (2013.01); C08G 73/026 (2013.01); C08G 73/0672 (2013.01); C09D 179/02 (2013.01); G03F 7/092 (2013.01); H01L 21/0274 (2013.01)] 13 Claims
 
1. A hard-mask forming composition which forms a hard mask that is used in lithography, comprising:
a resin (P) having a structural unit (u11) represented by General Formula (u11-1),

OG Complex Work Unit Chemistry
wherein R11 and R12 are each independently an organic group having 1 to 40 carbon atoms or a hydrogen atom, R15a and R15b are each independently an aromatic hydrocarbon group having 6 to 30 carbon atoms, which may have a substituent, or a hydrogen atom R15a and R15b may be bonded to each other to form a structure having an aromatic heterocyclic ring, R16 and R17 are each independently an aromatic hydrocarbon group having 6 to 30 carbon atoms, which may have a substituent, or a hydrogen atom, R16 and R17 may be bonded to each other to form a structure having an aromatic ring, and a hydrogen atom of a phenylene group in the formula may be substituted with a substituent.