US 12,221,553 B2
Water-based binder solutions for use in additive manufacturing processes
Arunkumar Natarajan, Mason, OH (US); and William C. Alberts, Saratoga Springs, NY (US)
Assigned to General Electric Company, Evendale, OH (US)
Filed by General Electric Company, Schenectady, NY (US)
Filed on Jul. 28, 2022, as Appl. No. 17/876,028.
Prior Publication US 2024/0034902 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. C09D 139/06 (2006.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C09D 7/20 (2018.01); C09D 7/45 (2018.01)
CPC C09D 139/06 (2013.01) [B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C09D 7/20 (2018.01); C09D 7/45 (2018.01); B29K 2039/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A water-based binder solution for use in additive manufacturing, comprising:
a thermoplastic binder comprising:
a first polymer strand having a weight average molecular weight (Mw) greater than or equal to 5,000 g/mol and less than or equal to 15,000 g/mol; and
at least one of a second polymer strand having a weight average molecular weight (Mw) greater than or equal to 10,000 g/mol and less than or equal to 50,000 g/mol and a third polymer strand having a weight average molecular weight (Mw) greater than or equal to 1,000 g/mol and less than or equal to 5,000 g/mol;
wherein the first polymer strand differs from each of the second polymer strand and the third polymer strand and the second polymer strand differs from the third polymer strand;
greater than or equal to 4 wt % to less than or equal to 20 wt % of a non-aqueous solvent, based on a total weight of the water-based binder solution, the non-aqueous solvent having a boiling point greater than or equal to 100° C. and less than or equal to 175° C.; and
water.