US 12,221,536 B2
Insulating film, metal-clad laminate member, and rewiring layer
Cheng Ping Lin, Kyoto (JP); Toshiyuki Makita, Mie (JP); and Naohito Fukuya, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/921,263
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Mar. 25, 2021, PCT No. PCT/JP2021/012558
§ 371(c)(1), (2) Date Oct. 25, 2022,
PCT Pub. No. WO2021/220684, PCT Pub. Date Nov. 4, 2021.
Claims priority of application No. 2020-078600 (JP), filed on Apr. 27, 2020.
Prior Publication US 2023/0174772 A1, Jun. 8, 2023
Int. Cl. H05K 1/03 (2006.01); B32B 15/092 (2006.01); B32B 15/098 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); B32B 27/42 (2006.01); C08J 5/18 (2006.01); C08L 63/00 (2006.01); B32B 15/20 (2006.01)
CPC C08L 63/00 (2013.01) [B32B 15/092 (2013.01); B32B 15/098 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08J 5/18 (2013.01); H05K 1/0373 (2013.01); B32B 15/20 (2013.01); B32B 2264/1021 (2020.08); B32B 2264/303 (2020.08); B32B 2270/00 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08J 2433/08 (2013.01); C08J 2471/10 (2013.01); C08L 2201/02 (2013.01); C08L 2203/202 (2013.01); C08L 2205/03 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An insulating film comprising a semi-cured product of a resin composition,
the resin composition containing: at least one of a component (A1) or a component (A2); a component (B); a component (C1); and a component (C2),
the component (A1) including an epoxy resin having at least one of a naphthalene skeleton or a biphenyl skeleton,
the component (A2) including a phenolic resin having at least one of the naphthalene skeleton or the biphenyl skeleton,
the component (B) including a high molecular weight substance having structures expressed by at least the following formulae (b2) and (b3) out of the following formulae (b1), (b2), and (b3) and having a weight average molecular weight equal to or greater than 200,000 and equal to or less than 850,000,
the component (C1) including a first filler obtained by subjecting a first inorganic filler to surface treatment using a first silane coupling agent expressed by the following formula (c1),
the component (C2) including a second filler obtained by subjecting a second inorganic filler to surface treatment using a second silane coupling agent expressed by the following formula (c2),
the insulating film containing an inorganic filler having a maximum particle size equal to or less than 5 μm,
the insulating film having a thickness equal to or greater than 0.1 μm and equal to or less than 10 μm,

OG Complex Work Unit Chemistry
(R6)Si(R5)3  (c1)
(R8)Si(R7)3  (c2)
where x in the formula (b1), y in the formula (b2), and z in the formula (b3) satisfy the following relational expression: x:y:z (in mole fractions)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≤1, 0≤x≤0.2, 0.6≤y≤0.95, and 0.05≤z≤0.2); in the formula (b2), R1 is either a hydrogen atom or a methyl group, R2 is selected from the group consisting of a hydrogen atom, an alkyl group, a glycidyl group, and an epoxidized alkyl group and at least includes either the glycidyl group or the epoxidized alkyl group; in the formula (b3), R3 is either a hydrogen atom or a methyl group and R4 is Ph (phenyl group), —COOCH2Ph, or —COO(CH2)2Ph; in the formula (c1), R5 is either a methoxy group or an ethoxy group and R6 has an isocyanate group, a glycidyl group, or an amino group at an end of an aliphatic alkyl group having a carbon number equal to or greater than 3 and equal to or less than 18; and in the formula (c2), R7 is either a methoxy group or an ethoxy group and R8 has either a methacryloyl group or a vinyl group at an end of an aliphatic alkyl group having a carbon number equal to or greater than 3 and equal to or less than 18.