US 12,221,532 B2
Propylene-based resin composition and film for heat sealing
Seishi Yoshikawa, Yokohama (JP); Koki Shibata, Yokohama (JP); Atsushi Ebata, Yokohama (JP); and Takayuki Ishihara, Yokohama (JP)
Assigned to TOYO SEIKAN GROUP HOLDINGS, LTD., Tokyo (JP)
Appl. No. 17/763,946
Filed by TOYO SEIKAN GROUP HOLDINGS, LTD., Tokyo (JP)
PCT Filed Sep. 3, 2020, PCT No. PCT/JP2020/033378
§ 371(c)(1), (2) Date Mar. 25, 2022,
PCT Pub. No. WO2021/059913, PCT Pub. Date Apr. 1, 2021.
Claims priority of application No. 2019-175237 (JP), filed on Sep. 26, 2019.
Prior Publication US 2022/0332930 A1, Oct. 20, 2022
Int. Cl. C08L 23/12 (2006.01); C08L 23/06 (2006.01); C08L 23/16 (2006.01)
CPC C08L 23/12 (2013.01) [C08L 23/06 (2013.01); C08L 23/16 (2013.01); C08L 2203/162 (2013.01); C08L 2207/02 (2013.01); C08L 2207/064 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A propylene-based resin composition comprising:
an impact polypropylene component (A), and
a linear low-density polyethylene component (B) containing methylpentene as a comonomer, wherein
the propylene-based resin composition contains a xylene-soluble fraction in an amount of 8 mass % or higher, and
an intrinsic viscosity measured for the xylene-soluble fraction is in a range of 1.0 to 2.9 dL/g.