US 12,221,389 B2
Aluminum/ceramic bonding substrate and method for producing same
Koji Kobayashi, Tokyo (JP); Takuma Tsubota, Tokyo (JP); Hideyo Osanai, Tokyo (JP); and Daisuke Oya, Tokyo (JP)
Assigned to DOWA METALTECH CO., LTD., Tokyo (JP); and Mitsubishi Electric Corporation, Tokyo (JP)
Filed by DOWA METALTECH CO, LTD., Tokyo (JP); and Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Jul. 23, 2021, as Appl. No. 17/383,541.
Claims priority of application No. 2020-128068 (JP), filed on Jul. 29, 2020.
Prior Publication US 2022/0033317 A1, Feb. 3, 2022
Int. Cl. C22C 21/08 (2006.01); B32B 15/04 (2006.01); C04B 37/02 (2006.01); H05K 3/10 (2006.01)
CPC C04B 37/021 (2013.01) [C22C 21/08 (2013.01); H05K 3/101 (2013.01); B32B 15/04 (2013.01); C04B 2235/95 (2013.01); C04B 2237/366 (2013.01); C04B 2237/402 (2013.01); C04B 2237/704 (2013.01); H05K 2203/128 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An aluminum/ceramic bonding substrate comprising:
a ceramic substrate;
an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate;
an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate; and
a plate-shaped reinforcing member having a higher strength than that of the aluminum base plate, the reinforcing member being arranged in the aluminum base plate to be bonded directly to the aluminum base plate, the reinforcing member being a ceramic substrate made of aluminum nitride,
wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities, and
wherein said aluminum plate has a surface having an average crystalline particle diameter of not greater than 7 mm.