US 12,221,371 B2
Systems and methods for producing ultrapure water for semiconductor fabrication processes
En Tian Lin, Taoyuan (TW); and Shih-Hsiung Chiang, Tainan (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Hsinchu (TW)
Filed on Mar. 21, 2022, as Appl. No. 17/699,371.
Prior Publication US 2023/0295027 A1, Sep. 21, 2023
Int. Cl. C02F 9/00 (2023.01); G03F 7/00 (2006.01); G03F 7/20 (2006.01); C02F 1/20 (2023.01); C02F 1/28 (2023.01); C02F 1/32 (2023.01); C02F 1/44 (2023.01); C02F 1/72 (2023.01); C02F 1/78 (2023.01); C02F 3/12 (2023.01); C02F 101/30 (2006.01); C02F 103/04 (2006.01); C02F 103/34 (2006.01)
CPC C02F 9/00 (2013.01) [G03F 7/2041 (2013.01); G03F 7/70341 (2013.01); C02F 1/20 (2013.01); C02F 1/283 (2013.01); C02F 1/32 (2013.01); C02F 1/441 (2013.01); C02F 1/444 (2013.01); C02F 1/722 (2013.01); C02F 1/725 (2013.01); C02F 1/78 (2013.01); C02F 3/1268 (2013.01); C02F 2101/30 (2013.01); C02F 2103/04 (2013.01); C02F 2103/346 (2013.01); C02F 2301/046 (2013.01); C02F 2301/08 (2013.01); C02F 2305/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for producing ultrapure water (UPW) for use in semiconductor fabrication, comprising:
treating raw water in a water treatment process to obtain the ultrapure water, wherein the water treatment process includes:
an ABA module that performs:
an advanced oxidation process (AOP) pre-treatment step that feeds a bioremediation step; and
an advanced oxidation process post-treatment step that is fed by the bioremediation step,
wherein the ABA module is directly upstream of a resin adsorption unit;
a membrane degasification (MDG) unit downstream of the resin adsorption unit; and
an ultrafiltration (UF) unit downstream of the MDG unit;
wherein the raw water has a total organic carbon (TOC) content of greater than 0.1 ppm, and the resulting ultrapure water has a total organic carbon (TOC) content of less than 1.0 ppb.