| CPC B81C 1/00182 (2013.01) [B81B 7/007 (2013.01); B81C 1/00158 (2013.01); B81C 1/00301 (2013.01); H01L 23/481 (2013.01); B81B 2201/02 (2013.01)] | 19 Claims | 

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               1. An electronic device, comprising: 
            a base substrate comprising: 
                a substrate top side; a substrate bottom side opposite to the substrate top side; a passageway extending through the base substrate from the substrate top side to the substrate bottom side; a first conductive structure; and a dielectric structure; 
                a sensor device comprising: a sensor top side; a sensor bottom side opposite to the sensor top side; and a cavity extending partially inward from the sensor bottom side; and a barrier attached to the sensor bottom side and extending across the cavity, wherein: the sensor device is coupled to the first conductive structure; 
                the barrier comprises first barrier strand structures defining first barrier through-holes; and the barrier is attached to the substrate top side so that the first barrier through-holes overlie the passageway and the barrier is interposed between the sensor bottom side and the substrate top side; and one or more of: second barrier strand structures attached to the first barrier strand structures, the second barrier strand structures defining second barrier through-holes that are offset with respect to the first barrier through-holes; a conformal layer over the first barrier strand structures. 
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