US 12,221,296 B2
Substrate processing apparatus and method
Ho Chul Choi, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Aug. 30, 2023, as Appl. No. 18/458,252.
Claims priority of application No. 10-2022-0118192 (KR), filed on Sep. 19, 2022.
Prior Publication US 2024/0092591 A1, Mar. 21, 2024
Int. Cl. B65G 49/06 (2006.01); B65G 47/91 (2006.01); H01L 21/677 (2006.01)
CPC B65G 49/065 (2013.01) [B65G 47/917 (2013.01); H01L 21/67784 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a floating stage configured to float a substrate;
lift pins configured to be liftably mounted in the floating stage;
a substrate aligner configured to align the substrate floated from the floating stage;
a gripper configured to vacuum-suck the aligned substrate; and
a controller configured to control a floating height of the substrate,
wherein the controller is configured to float the substrate to a first floating height by using the floating stage, and
the controller is configured to lower the substrate to a second floating height lower than the first floating height by using the floating stage, when the gripper fails to vacuum-suck the substrate.