US 12,220,927 B2
Thermal head
Kazuyuki Hoshi, Tokyo (JP); Hiroshi Kokuta, Tokyo (JP); and Tatsuyuki Takahashi, Tokyo (JP)
Assigned to SATO HOLDINGS KABUSHIKI KAISHA, Tokyo (JP)
Appl. No. 18/252,847
Filed by SATO HOLDINGS KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Nov. 10, 2021, PCT No. PCT/JP2021/041378
§ 371(c)(1), (2) Date May 12, 2023,
PCT Pub. No. WO2022/107666, PCT Pub. Date May 27, 2022.
Claims priority of application No. 2020-191682 (JP), filed on Nov. 18, 2020.
Prior Publication US 2024/0001688 A1, Jan. 4, 2024
Int. Cl. B41J 2/335 (2006.01)
CPC B41J 2/33505 (2013.01) [B41J 2/3358 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A thermal head comprising:
a heat dissipation plate having a first surface of a substantially rectangular shape in a plane view, and a second surface that is on an opposite side to the first surface;
a board attached to the heat dissipation plat in such a manner as to extend from the first surface to the second surface, via a first end part interposed between the first surface and the second surface;
a heating part having a plurality of heating elements, the heating part being disposed on the board over the first surface; and
surface-mount devices mounted on the board over the second surface.