US 12,220,839 B2
Inspection substrate
Yoshikatsu Soejima, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Aug. 10, 2021, as Appl. No. 17/398,289.
Claims priority of application No. 2020-142767 (JP), filed on Aug. 26, 2020.
Prior Publication US 2022/0063134 A1, Mar. 3, 2022
Int. Cl. B28D 5/00 (2006.01); G01N 21/95 (2006.01)
CPC B28D 5/0058 (2013.01) [G01N 21/9501 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An inspecting method of inspecting, by using an inspection substrate, whether or not a constituent element of a wafer cutting apparatus may form a scratch on a top surface of a workpiece when a cutting blade cuts the workpiece by simulating a cutting operation on the inspection substrate,
the inspection substrate comprising a disk-shape wafer including:
a top surface side of the inspection substrate having a groove portion for simulated cutting, and
a paint layer disposed on the top surface side of the inspection substrate including being disposed within the groove portion of the inspection substrate to improve visibility of a scratch formed on the top surface side, the paint layer having a thickness, the paint layer having a color different from a color of the top surface side of the inspection substrate,
the groove portion having a width greater than the width of a cutting blade of the wafer cutting apparatus such that the cutting blade may be operated within the groove portion without contacting sides of the groove portion or the paint layer disposed on the sides of the groove portion, the groove portion having a depth greater than a maximum amount of blade protrusion of the cutting blade such that the cutting blade may be operated within the groove portion without contacting a bottom of the groove portion or the paint layer disposed on the bottom of the groove portion,
the inspecting method comprising:
a holding step of holding an undersurface side of the inspection substrate, with the top surface of the inspection substrate set upward, by a chuck table disposed in a mounting and demounting region of the wafer cutting apparatus;
a moving step of moving the chuck table from the mounting and demounting region to a cutting region of the wafer cutting apparatus in which simulated cutting of the inspection substrate is performed after the holding step;
a simulated cutting step of performing the simulated cutting by positioning a lower end of the cutting blade at a predetermined height higher than the bottom of the groove portion and the paint layer disposed on the bottom of the groove portion and passing a part of the cutting blade in the groove portion while the cutting blade is being rotated; and
an image obtaining step of obtaining an image of the top surface side of the inspection substrate.