| CPC B23P 19/062 (2013.01) | 20 Claims |

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1. A device for installing a self-attaching fastener on a substrate, the device comprising:
a punch including an inner pin and an outer pin, said inner and outer pins being coaxial and translatable along an axis, wherein in a first state of the punch, the inner pin is movable independently of the outer pin, and wherein in a second state of the punch, the inner and outer pins are movable concurrently; and
a die having an engagement surface configured to receive and support the substrate thereon,
wherein said punch is operable in first and second stages, wherein in said first stage, said punch is in said first state and configured to pierce a through-hole in said substrate via said inner pin, and wherein in said second stage, said punch is in said second state and configured to insert a portion of said self-attaching fastener through said through-hole and attach said self-attaching fastener to said substrate.
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