US 12,220,768 B2
Solder paste bead recovery system and method
William A. Losiewicz, Douglas, MA (US); Matthew F. Schumacher, Edina, MN (US); Bruce C. Seaton, Essex (GB); and Kenneth J. King, East Freetown, MA (US)
Assigned to Illinois Tool Works Inc., Glenview, IL (US)
Filed by Illinois Tool Works Inc., Glenview, IL (US)
Filed on Aug. 24, 2023, as Appl. No. 18/237,458.
Application 18/237,458 is a division of application No. 17/725,058, filed on Apr. 20, 2022, granted, now 11,766,730.
Application 17/725,058 is a continuation of application No. 16/897,526, filed on Jun. 10, 2020, granted, now 11,318,549, issued on May 3, 2022.
Claims priority of provisional application 62/991,744, filed on Mar. 19, 2020.
Claims priority of provisional application 62/861,035, filed on Jun. 13, 2019.
Claims priority of provisional application 62/861,025, filed on Jun. 13, 2019.
Claims priority of provisional application 62/861,031, filed on Jun. 13, 2019.
Prior Publication US 2023/0390847 A1, Dec. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 3/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01)
CPC B23K 3/0638 (2013.01) [B23K 3/08 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method of recovering assembly material from a stencil scheduled for replacement, the method comprising:
moving a receptacle onto a used stencil proximate assembly material;
moving assembly material onto the receptacle;
removing the receptacle from the used stencil;
replacing the used stencil with a new stencil;
moving the receptacle onto the new stencil;
moving assembly material onto the new stencil with the squeegee blade assembly; and
removing the receptacle from the new stencil.