US 12,220,767 B2
Control device and control method for additive manufacturing system
Yoshiyuki Matsui, Tokyo (JP); Nobuyuki Sumi, Tokyo (JP); and Shun Kayashima, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 18/712,994
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Feb. 25, 2022, PCT No. PCT/JP2022/007947
§ 371(c)(1), (2) Date May 23, 2024,
PCT Pub. No. WO2023/162156, PCT Pub. Date Aug. 31, 2023.
Prior Publication US 2024/0416454 A1, Dec. 19, 2024
Int. Cl. B23K 26/342 (2014.01); B23K 26/082 (2014.01); B23K 31/02 (2006.01); B33Y 50/02 (2015.01)
CPC B23K 26/342 (2015.10) [B23K 26/082 (2015.10); B23K 31/02 (2013.01); B33Y 50/02 (2014.12)] 14 Claims
OG exemplary drawing
 
1. A control device for an additive manufacturing system to emit a heat source onto feedstock fed onto a workpiece to melt and solidify the feedstock into beads, and build an object by stacking the beads on the workpiece, the control device controlling, on a basis of molten pool state measurement information, at least one of: power of the heat source; or a scanning speed of the heat source and a material feed speed of the feedstock, the molten pool state measurement information being a value obtained by measurement of a state of a molten pool, the molten pool being the melted feedstock, the control device comprising:
processing condition output circuitry to output values of the power of the heat source, the scanning speed of the heat source, and the material feed speed to the additive manufacturing system;
heat source power addition circuitry to output a post-addition value of the power of the heat source to the processing condition output circuitry when a molten pool state error is less than a predetermined threshold and the value of the power of the heat source output from the processing condition output circuitry is less than maximum power of the heat source, the post-addition value being a value of the power of the heat source having a predetermined addition value added, the molten pool state error being a difference between molten pool state target information and the molten pool state measurement information, the molten pool state target information being a targeted value of the state of the molten pool;
molten pool state error calculation circuitry to calculate the molten pool state error from a captured image of the state of the molten pool; and
speed adjustment circuitry to adjust the scanning speed of the heat source and the material feed speed on the basis of the molten pool state error.