US 12,220,762 B2
Device and method for processing a workpiece along a predetermined processing line using a pulsed polychromatic laser beam and a filter
Andreas Ortner, Gau-Algesheim (DE); Fabian Wagner, Mainz (DE); Albrecht Seidl, Niedernberg (DE); Simon Schmitt, Wiesbaden (DE); Frank-Thomas Lentes, Bingen (DE); and Jens Ulrich Thomas, Mainz (DE)
Assigned to SCHOTT AG, Mainz (DE)
Filed by SCHOTT AG, Mainz (DE)
Filed on Nov. 18, 2019, as Appl. No. 16/687,231.
Application 16/687,231 is a continuation of application No. PCT/EP2018/062365, filed on May 14, 2018.
Claims priority of application No. 10 2017 208 290.9 (DE), filed on May 17, 2017.
Prior Publication US 2020/0101561 A1, Apr. 2, 2020
Int. Cl. B23K 26/06 (2014.01); B23K 26/00 (2014.01); B23K 26/046 (2014.01); B23K 26/0622 (2014.01); B23K 26/064 (2014.01); B23K 26/066 (2014.01); B23K 26/08 (2014.01); B23K 26/53 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01); C03B 33/02 (2006.01)
CPC B23K 26/0648 (2013.01) [B23K 26/046 (2013.01); B23K 26/0622 (2015.10); B23K 26/0624 (2015.10); B23K 26/064 (2015.10); B23K 26/066 (2015.10); B23K 26/083 (2013.01); B23K 26/53 (2015.10); C03B 33/0222 (2013.01); B23K 26/0006 (2013.01); B23K 2101/40 (2018.08); B23K 2103/42 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08)] 20 Claims
OG exemplary drawing
 
1. A method for processing a workpiece along a predetermined processing line, comprising:
generating a pulsed polychromatic laser beam with a pulse duration of less than 1 ps and a wavelength in the range of 350 nm to 2400 nm;
guiding the laser beam using an optical arrangement in order to generate a focal line along a beam direction of the laser beam, the optical arrangement having chromatic aberration for wavelength-dependent focusing of the laser beam; and
generating a relative movement between the laser beam and the workpiece along the predetermined processing line, in order to process the workpiece by the laser beam, wherein the workpiece comprises a material selected from a group consisting of glass, glass ceramic, and plastic, wherein the material is at least partially transparent for wavelengths of the laser beam, wherein the depth ofprocessing of the workpiece along the predetermined processing line is adjusted.