US 12,220,732 B2
Substrate cleaning system and substrate cleaning method
Hiroki Takahashi, Tokyo (JP); Kohei Sato, Tokyo (JP); and Koichi Fukaya, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/783,069
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Nov. 25, 2020, PCT No. PCT/JP2020/043805
§ 371(c)(1), (2) Date Jun. 7, 2022,
PCT Pub. No. WO2021/117485, PCT Pub. Date Jun. 17, 2021.
Claims priority of application No. 2019-223429 (JP), filed on Dec. 11, 2019.
Prior Publication US 2023/0023260 A1, Jan. 26, 2023
Int. Cl. B08B 1/10 (2024.01); B08B 1/20 (2024.01); B08B 3/02 (2006.01); B08B 3/08 (2006.01); B08B 3/14 (2006.01); B08B 13/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01)
CPC B08B 3/08 (2013.01) [B08B 1/10 (2024.01); B08B 1/20 (2024.01); B08B 3/022 (2013.01); B08B 3/14 (2013.01); B08B 13/00 (2013.01); H01L 21/02057 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); B08B 2203/007 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate cleaning system comprising:
a heater configured to heat pure water;
a chemical-liquid diluting module configured to mix chemical liquid and the pure water heated by the heater at a predetermined volume ratio to produce diluted chemical liquid;
a chemical-liquid supply line coupled to the heater and the chemical-liquid diluting module; and
a cleaning module configured to clean a substrate,
wherein the chemical-liquid diluting module includes a chemical-liquid supply source and a chemical-liquid coupling line that couples the chemical-liquid supply source to the chemical-liquid supply line,
wherein the cleaning module comprises:
a substrate holding device configured to hold the substrate;
a cleaning member configured to contact the substrate and scrub the substrate;
a chemical-liquid supply nozzle configured to supply the diluted chemical liquid to the substrate; and
a pure-water supply nozzle configured to supply the heated pure water to the substrate,
wherein a temperature of the diluted chemical liquid is determined to be higher than a normal temperature thereof and lower than a glass transition point of the cleaning member, and
the cleaning member is configured to scrub the substrate while the diluted chemical liquid having the determined temperature is supplied to the substrate.