US 12,220,729 B2
Partially compressed cleaning substrate for media transport device
John Condon, Sumner, ME (US); and Joshua Lee Larsen, Turner, ME (US)
Assigned to KICTeam, Inc., Auburn, ME (US)
Filed by KICTeam, Inc., Auburn, ME (US)
Filed on Feb. 10, 2023, as Appl. No. 18/167,541.
Claims priority of provisional application 63/267,881, filed on Feb. 11, 2022.
Prior Publication US 2023/0256475 A1, Aug. 17, 2023
Int. Cl. B08B 1/14 (2024.01); A47L 13/16 (2006.01); B32B 5/02 (2006.01); B32B 5/18 (2006.01); B32B 5/24 (2006.01); B32B 7/027 (2019.01); B32B 27/08 (2006.01); B32B 37/10 (2006.01); B65G 45/10 (2006.01)
CPC B08B 1/143 (2024.01) [A47L 13/16 (2013.01); B32B 5/022 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 7/027 (2019.01); B32B 27/08 (2013.01); B32B 37/10 (2013.01); B65G 45/10 (2013.01); B32B 2262/0269 (2013.01); B32B 2266/0235 (2013.01); B32B 2266/025 (2013.01); B32B 2266/0278 (2013.01); B32B 2307/5825 (2013.01); B32B 2425/00 (2013.01); B32B 2432/00 (2013.01)] 20 Claims
OG exemplary drawing
 
10. A method of manufacturing a cleaning tool comprising:
contacting a first core layer to a first cleaning layer, wherein the first cleaning layer comprises a cleaning area and an intermediate area;
positioning a cavity in the cleaning area under the first cleaning layer; and
after positioning the cavity in the cleaning area, compressing the intermediate area by applying pressure to the intermediate area such that the intermediate area is compressed to a first thickness, while not compressing the cleaning area and allowing the cleaning area to remain at a second thickness is greater than the first thickness.