US 12,220,590 B2
Feedthrough assembly and device including same
Andrew J. Ries, Lino Lakes, MN (US); Chunho Kim, Phoenix, AZ (US); Robert A. Munoz, Andover, MN (US); Christopher T. Kinsey, East Bethel, MN (US); Jeffrey Voss, White Bear Lake, MN (US); Kris A. Peterson, Edina, MN (US); and Mark E. Henschel, Phoenix, AZ (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by Medtronic, Inc., Minneapolis, MN (US)
Filed on Mar. 22, 2023, as Appl. No. 18/124,706.
Application 18/124,706 is a continuation of application No. 17/125,250, filed on Dec. 17, 2020, granted, now 11,633,611.
Claims priority of provisional application 62/950,694, filed on Dec. 19, 2019.
Prior Publication US 2023/0218911 A1, Jul. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/375 (2006.01)
CPC A61N 1/3754 (2013.01) [A61N 1/37512 (2017.08); A61N 1/3756 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An implantable medical device comprising:
an elongated housing extending along a longitudinal axis;
a power source; and
an electronics module electrically connected to the power source, the electronics module comprising a plurality of electronic layers disposed in the housing and a feedthrough header assembly electrically connected to at least one of the electronic layers;
wherein each electronic layer comprises a substrate having a first major surface, the first major surface being oriented substantially orthogonal to the longitudinal axis;
wherein the feedthrough header assembly comprises:
an electrically conductive header comprising an inner surface and an outer surface;
a dielectric substrate disposed between the inner surface of the header and the electronics module; and
a feedthrough pin that extends through the header in the outward direction beyond the outer surface of the header.