US 12,220,278 B2
Medical device comprising sensor array and system for measurements
Arjen Van Der Horst, Tilburg (NL); Roland Alexander Van De Molengraaf, Geldrop (NL); Vincent Adrianus Henneken, Utrecht (NL); Johannes Wilhelmus Weekamp, Beek en Donk (NL); Maarten Petrus Joseph Kuenen, Veldhoven (NL); Sergei Y. Shulepov, Eindhoven (NL); and Bruno Jean François Frackowiak, The Hague (NL)
Assigned to KONINKLIJKE PHILIPS N.V., Eindhoven (NL)
Appl. No. 17/040,217
Filed by KONINKLIJKE PHILIPS N.V., Eindhoven (NL)
PCT Filed Mar. 11, 2019, PCT No. PCT/EP2019/055938
§ 371(c)(1), (2) Date Sep. 22, 2020,
PCT Pub. No. WO2019/179795, PCT Pub. Date Sep. 26, 2019.
Claims priority of application No. 18163698 (EP), filed on Mar. 23, 2018.
Prior Publication US 2021/0007711 A1, Jan. 14, 2021
Int. Cl. A61B 8/00 (2006.01); A61B 8/06 (2006.01); A61B 8/12 (2006.01)
CPC A61B 8/4494 (2013.01) [A61B 8/06 (2013.01); A61B 8/12 (2013.01)] 16 Claims
OG exemplary drawing
 
1. Interventional medical device, comprising:
an elongate body comprising:
a longitudinal axis;
a forward-facing surface at a distal end of the elongate body;
a side-facing surface; and
an edge located where the side-facing surface and the forward-facing surface join; and
a sensor arrangement disposed at the distal end of the elongate body such that the sensor arrangement is distinct from the elongate body, wherein the sensor arrangement comprises:
a carrier coupled to the forward-facing surface, the edge, and the side-facing surface of the elongate body, wherein the carrier comprises:
a first side;
an opposite second side;
a proximal portion; and
a distal portion, wherein the distal portion of the carrier comprises a body segment, a finger segment distal of the body segment, and a middle segment between the body segment and the finger segment along the longitudinal axis;
a first wafer portion formed on the body segment on the second side of the carrier;
a second wafer portion formed on the finger segment on the second side of the carrier; and
a sensor element provided in the second wafer portion and not in the first wafer portion,
wherein the first wafer portion and the second wafer portion are spaced from one another along the longitudinal axis such that no material extends over the middle segment of the carrier;
wherein the carrier is configured for electrical conduction of signals from the proximal portion of the carrier to the sensor element;
wherein the middle segment of the carrier is positioned on the edge of the elongate body, wherein the finger segment of the carrier, the second wafer portion, and the sensor element are positioned on the forward-facing surface of the elongate body such that the sensor element and the forward-facing surface are distinct from one another; and
wherein the body segment of the carrier and the first wafer portion are positioned on the side-facing surface of the elongate body.