US 12,220,239 B2
Long-term implantable electronic devices
John A. Rogers, Wilmette, IL (US); Hui Fang, Urbana, IL (US); Jianing Zhao, Urbana, IL (US); Enming Song, Urbana, IL (US); and Yoon Kyeung Lee, Urbana, IL (US)
Assigned to NORTHWESTERN UNIVERSITY, Evanston, IL (US); and THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS, Urbana, IL (US)
Filed by NORTHWESTERN UNIVERSITY, Evanston, IL (US); and THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS, Urbana, IL (US)
Filed on Nov. 30, 2022, as Appl. No. 18/072,035.
Application 18/072,035 is a division of application No. 16/162,613, filed on Oct. 17, 2018, granted, now 11,517,238.
Claims priority of provisional application 62/738,608, filed on Sep. 28, 2018.
Claims priority of provisional application 62/573,533, filed on Oct. 17, 2017.
Prior Publication US 2023/0103690 A1, Apr. 6, 2023
Int. Cl. A61B 5/283 (2021.01); A61B 5/03 (2006.01); A61B 5/361 (2021.01); A61N 1/05 (2006.01); G01N 27/414 (2006.01); H01L 21/02 (2006.01)
CPC A61B 5/283 (2021.01) [A61B 5/031 (2013.01); A61B 5/361 (2021.01); A61N 1/0587 (2013.01); H01L 21/02115 (2013.01); H01L 21/02118 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 21/02258 (2013.01); H01L 21/02271 (2013.01); H01L 21/02282 (2013.01); G01N 27/414 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A long-term implantable electronic device, comprising:
a first thermally oxidized layer from a first substrate, wherein the first thermally oxidized layer forms a first encapsulation layer;
an electronic component supported by the first encapsulation layer, wherein the electronic component and the first encapsulation layer have an exposed surface relative to the first encapsulation layer;
a barrier layer that covers the first encapsulation layer and the electronic component exposed surface;
a second thermally oxidized layer from a second substrate, wherein the second thermally oxidized layer forms a second encapsulation layer, and the second encapsulation layer is in contact with the barrier layer;
wherein each of the first and second encapsulation layers, the barrier layer, and the electronic component are flexible or bendable, so that the long-term implantable electronic device is configured to conformally contact with a curved biological surface.