| CPC H10N 70/8616 (2023.02) [H10B 63/24 (2023.02); H10B 63/80 (2023.02); H10N 70/063 (2023.02); H10N 70/231 (2023.02); H10N 70/841 (2023.02); H10N 70/8828 (2023.02)] | 17 Claims |

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1. A method for making a phase change memory, comprising:
preparing a substrate, and forming a laminated structure on the substrate, the laminated structure sequentially includes, from bottom to top, a first electrode material layer, a first transition material layer, an ovonic threshold switching (OTS) material layer, a second transition material layer, a second electrode material layer, a third transition material layer, a phase change material layer, a fourth transition material layer, and a third electrode material layer; wherein the first transition material layer consists of C, the second transition material layer consists of C, the third transition material layer consists of TaC, and the fourth transition material layer consists of TaC;
fabricating an isolation groove in the laminated structure, the isolation groove extends downwards from a top surface of the laminated structure to a surface of the substrate to separate the laminated structure into a plurality of columnar structures; and
forming an isolation material layer in the isolation groove, and the isolation material layer surrounds side surfaces of the columnar structure.
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