US 12,219,856 B2
Display device and method for manufacturing the same
Jin-Yup Kim, Cheonan-si (KR); Deukjong Kim, Cheonan-si (KR); and Hagyeong Song, Cheonan-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Jul. 10, 2023, as Appl. No. 18/349,943.
Application 18/349,943 is a division of application No. 16/855,646, filed on Apr. 22, 2020, granted, now 11,700,758.
Claims priority of application No. 10-2019-0088190 (KR), filed on Jul. 22, 2019.
Prior Publication US 2023/0363237 A1, Nov. 9, 2023
Int. Cl. H10K 59/40 (2023.01); H01L 27/12 (2006.01); H10K 50/84 (2023.01); H10K 59/12 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01); H10K 102/00 (2023.01)
CPC H10K 59/40 (2023.02) [H01L 27/124 (2013.01); H01L 27/1248 (2013.01); H10K 50/84 (2023.02); H10K 59/1201 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 2102/00 (2023.02)] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a display device comprising a light-emitting element at a display area, a driving element electrically connected to the light-emitting element, and a connection pad at a bonding area, the method comprising:
forming a lower conductive layer of the connection pad;
forming an intermediate conductive layer of the connection pad to electrically contact the lower conductive layer;
forming a cladding layer to cover a side surface of the intermediate conductive layer while exposing an upper surface of the intermediate conductive layer;
forming a passivation layer to cover an upper surface of the cladding layer; and
forming an upper conductive layer of the connection pad to electrically contact the intermediate conductive layer,
wherein the passivation layer covering the upper surface of the cladding layer extends to contact the upper surface of the intermediate conductive layer of the connection pad at the bonding area.