| CPC H10K 59/18 (2023.02) [H01L 23/4985 (2013.01); H01L 27/156 (2013.01); H10K 77/111 (2023.02); H10K 2102/311 (2023.02)] | 8 Claims |

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1. An electronic device, comprising:
a flexible substrate; and
a conductive wire, disposed on the flexible substrate and comprising a metal portion and a plurality of openings disposed in the metal portion,
wherein the plurality of openings comprise a first opening and a second opening arranged along a first direction, and the metal portion comprises a first extending portion, a second extending portion, a third extending portion, a fourth extending portion, a first joint portion, a second joint portion, a third joint portion, and a fourth joint portion,
wherein the first opening is surrounded by the first extending portion, the second extending portion, the first joint portion, and the second joint portion,
wherein the second opening is surrounded by the third extending portion, the fourth extending portion, the third joint portion, and the fourth joint portion,
wherein along the first direction, a ratio of a first width sum of a width of the first extending portion, a width of the second extending portion, a width of the third extending portion, and a width of the fourth extending portion to a second width sum of a width of the first joint portion and a width of the third joint portion is in a range from 0.8 to 1.2.
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