CPC H10B 43/40 (2023.02) [G11C 16/0483 (2013.01); G11C 16/08 (2013.01); G11C 16/24 (2013.01); H01L 21/02532 (2013.01); H01L 21/02639 (2013.01); H01L 21/02667 (2013.01); H01L 23/528 (2013.01); H01L 23/53271 (2013.01); H01L 29/04 (2013.01); H01L 29/16 (2013.01); H01L 29/36 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H10B 41/27 (2023.02); H10B 41/40 (2023.02); H10B 43/27 (2023.02); G11C 16/10 (2013.01); G11C 16/14 (2013.01); G11C 16/26 (2013.01); H01L 23/5329 (2013.01); H01L 29/0847 (2013.01)] | 20 Claims |
1. A method comprising:
forming a mask having an opening over pillars of a device, the pillars are separated from each other by a dielectric material;
removing a portion of each of the pillars and a portion of the dielectric material at a location at the opening;
forming a material at the location, the material having a first structure;
causing the first structure of the material to change to a second structure; and
removing part of the material having the second structure to form separate portions from a remaining part of the second structure, such that each of the separate portions contacts a portion of one of the pillars.
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