US 12,219,742 B2
Converter including heat transfer layer
Jae hoo Jung, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/770,766
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Nov. 13, 2020, PCT No. PCT/KR2020/016023
§ 371(c)(1), (2) Date Apr. 21, 2022,
PCT Pub. No. WO2021/096305, PCT Pub. Date May 20, 2021.
Claims priority of application No. 10-2019-0145059 (KR), filed on Nov. 13, 2019.
Prior Publication US 2022/0377931 A1, Nov. 24, 2022
Int. Cl. H05K 7/20 (2006.01); C09K 5/14 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01)
CPC H05K 7/209 (2013.01) [H05K 5/0026 (2013.01); H05K 5/0217 (2013.01); H05K 5/03 (2013.01); H05K 7/20927 (2013.01); C09K 5/14 (2013.01); H05K 7/20454 (2013.01); H05K 7/20472 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A converter comprising:
a housing including a refrigerant flow path;
a printed circuit board being disposed on an upper portion of the housing, and being disposed with electronic components on an upper surface thereof; and
a cover being disposed on an upper portion of the printed circuit board and covering an upper surface of the electronic components,
wherein a heat transfer layer filled with a thermal interface material is disposed on an upper surface of the housing or a lower surface of the cover being overlapped with the electronic components in up and down directions,
wherein a groove for accommodating the heat transfer layer is formed on the upper surface of the housing or the lower surface of the cover,
wherein a protruded part being protruded upward more than other regions is disposed on the upper surface of the housing,
wherein the protruded part is being disposed to be overlapped with the electronic components in the up and down directions,
wherein the heat transfer layer is disposed on an upper surface of the protruded part,
wherein the heat transfer layer is an area where thermal grease is applied,
wherein the electronic components include a terminal,
wherein the terminal is protruded downward penetrating through the printed circuit board,
wherein at least a portion of the terminal is disposed in the groove,
wherein a terminal groove to which the terminal is coupled is disposed on the upper surface of the housing,
wherein the heat transfer layer is disposed inside the terminal groove,
wherein the terminal groove is provided in plurality,
wherein the plurality of terminal grooves are respectively disposed on both sides of the protruded part,
wherein a first direction length of the heat transfer layer disposed in the terminal groove is longer than the first direction length of the heat transfer layer disposed on the protruded part, and
wherein the terminal overlaps the protruded part in a second direction perpendicular to the first direction.