US 12,219,740 B2
Reverse-return parallel loop thermal management system for an electronic device
Nan Chen, Alpharetta, GA (US); He Zhao, Flagstaff Hill (AU); and Yunshui Chen, Greer, SC (US)
Assigned to Advanced Liquid Cooling Technologies Inc., Anderson, SC (US)
Filed by Advanced Liquid Cooling Technologies Inc., Anderson, SC (US)
Filed on Jun. 28, 2021, as Appl. No. 17/360,003.
Prior Publication US 2022/0418166 A1, Dec. 29, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20772 (2013.01) [H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); H05K 7/20327 (2013.01); H05K 7/2039 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A reverse-return parallel loop thermal management system for an electronic device, comprising:
a plurality of heat sinks with a series of thermal pathways configured to provide hydraulically balanced liquid coolant to each heat sink in said plurality of heat sinks, wherein each heat sink diverts at least a portion of said liquid coolant across a heat sink exchanging core, thereby at least partially vaporizing said liquid coolant, and wherein each heat sink diverting a remaining portion of the liquid coolant to a downstream heat sink;
each heat sink in said plurality of heat sinks is configured to be in thermal communication with a heat source;
each heat sink in said plurality of heat sinks having a liquid-in port, a liquid-out port, a vapor-inlet port, and a vapor-outlet port;
each heat sink in said plurality of heat sinks is configured to have at least one thermal pathway, wherein said at least one thermal pathway begins at said liquid-in port and flows to a divide, thereby splitting said at least one thermal pathway in two separate thermal pathways, wherein a first path flows to said liquid-out port and a second path passes through said heat sink exchanging core,
flows out through said vapor-outlet port;
liquid coolant entering each heat sink and following a first thermal pathway flows through the first liquid outlet port as a liquid; and
liquid coolant entering each heat sink and following a second thermal pathway flows through said heat sink exchanging core, wherein said liquid is at least partially vaporized before exiting said heat sink through said vapor-outlet port.