US 12,219,739 B2
Element-mounted board and method for manufacturing element-mounted board
Daisuke Goto, Tokyo (JP); and Hiroaki Ota, Tokyo (JP)
Assigned to DENKA COMPANY LIMITED, Tokyo (JP)
Appl. No. 17/911,890
Filed by DENKA COMPANY LIMITED, Tokyo (JP)
PCT Filed Mar. 11, 2021, PCT No. PCT/JP2021/009761
§ 371(c)(1), (2) Date Sep. 15, 2022,
PCT Pub. No. WO2021/200011, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-063126 (JP), filed on Mar. 31, 2020.
Prior Publication US 2023/0156966 A1, May 18, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2039 (2013.01) 6 Claims
OG exemplary drawing
 
1. An element-mounted board comprising:
a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium; and
an electronic element including a ceramic plate, which is mounted on a side corresponding to one of the front and back surfaces of the heat-dissipating plate, wherein
a flatness of another of the front and back surfaces of the heat-dissipating plate is 600 μm or less,
a thermal expansion coefficient of the heat-dissipating plate between room temperature and 400° C. is a1,
a thermal expansion coefficient of the ceramic plate between room temperature and 400° C. is a2, and
a difference between a1 and a2 is 5.0 ppm K−1 or less.