US 12,219,737 B2
Cryogenic packaging for thermalization of low temperature devices
Oblesh Jinka, Stamford, CT (US); Salvatore Bernardo Olivadese, Stamford, CT (US); Sean Hart, Tarrytown, NY (US); Nicholas Torleiv Bronn, Long Island City, NY (US); Jerry M. Chow, White Plains, NY (US); Markus Brink, White Plains, NY (US); Patryk Gumann, Tarrytown, NY (US); and Daniela Florentina Bogorin, Syracuse, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jun. 19, 2019, as Appl. No. 16/445,470.
Prior Publication US 2020/0404806 A1, Dec. 24, 2020
Int. Cl. H05K 7/20 (2006.01); G06F 30/20 (2020.01); G06N 10/00 (2022.01); H01L 21/265 (2006.01); H01L 23/31 (2006.01); H01L 23/32 (2006.01); H01L 31/02 (2006.01); F28D 21/00 (2006.01); G06F 113/20 (2020.01)
CPC H05K 7/20372 (2013.01) [G06F 30/20 (2020.01); G06N 10/00 (2019.01); H01L 21/26593 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/32 (2013.01); H01L 31/0201 (2013.01); F28D 2021/0028 (2013.01); G06F 2113/20 (2020.01)] 16 Claims
OG exemplary drawing
 
1. A thermalization structure, comprising:
a detachable thermalization cover configured with a set of pillars on a designated surface of the thermalization cover;
a chip configured with a set of cavities, a cavity in the set of cavities having a cavity profile, wherein a pillar from the set of pillars corresponds to the cavity and has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple and align the chip to the thermalization cover through the pillar.