US 12,219,734 B2
Ultra dense processors with embedded microfluidic cooling
Bharath Ramakrishnan, Bellevue, WA (US); Husam Atallah Alissa, Redmond, WA (US); Christian L. Belady, Mercer Island, WA (US); Sean Michael James, Olympia, WA (US); and Vaidehi Oruganti, Kirkland, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Jun. 24, 2022, as Appl. No. 17/848,755.
Prior Publication US 2023/0422435 A1, Dec. 28, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01M 8/18 (2006.01)
CPC H05K 7/20263 (2013.01) [G06F 1/206 (2013.01); H05K 7/20272 (2013.01); H01M 8/184 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A processing unit comprising:
a first die;
a second die;
a microfluidic volume between the first die and the second die, the microfluidic volume configured to receive an electrochemical fluid flowing through the microfluidic volume;
a membrane positioned within the microfluidic volume configured to separate an anolyte fluid and a catalytic fluid of the electrochemical fluid; and
a heat transfer structure coupling the first die to the second die and located in the microfluidic volume.