US 12,219,733 B2
Method for assembling a liquid cooling assembly of a family of liquid cooling assemblies
Hadrien Bauduin, Villeneuve d'Ascq (FR); Ali Chehade, Moncheaux (FR); and Alexandre Alain Jean-Pierre Meneboo, Harnes (FR)
Assigned to OVH, Roubaix (FR)
Filed by OVH, Roubaix (FR)
Filed on Nov. 22, 2022, as Appl. No. 17/992,752.
Claims priority of application No. 21306655 (EP), filed on Nov. 29, 2021; and application No. 22306283 (EP), filed on Aug. 30, 2022.
Prior Publication US 2023/0171925 A1, Jun. 1, 2023
Int. Cl. B21D 53/02 (2006.01); F28D 1/03 (2006.01); F28D 9/00 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01)
CPC H05K 7/20254 (2013.01) [B21D 53/02 (2013.01); F28D 1/0308 (2013.01); F28D 9/0043 (2013.01); H01L 23/473 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01); H05K 7/20509 (2013.01); F28F 2280/06 (2013.01); H01L 2023/4068 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for assembling a liquid cooling assembly of a family of liquid cooling assemblies, including at least a first liquid cooling assembly and a second liquid cooling assembly, the method comprising:
providing a plurality of liquid cooling blocks, each of the liquid cooling blocks defining an internal fluid conduit for circulation of a cooling fluid therethrough, each of the liquid cooling blocks having a block thermal contact surface, the block thermal contact surface of each of the liquid cooling blocks having a same surface area;
providing a first heat spreading base having a first thermal contact surface on a lower side of the first heat spreading base, the first thermal contact surface being configured to be in thermal contact with a first heat-generating electronic component, the first heat spreading base defining at least one first pocket on an upper side thereof;
providing a second heat spreading base having a second thermal contact surface on a lower side of the second heat spreading base, the second thermal contact surface being configured to be in thermal contact with a second heat-generating electronic component, the second heat spreading base defining a plurality of second pockets on an upper side thereof,
the second thermal contact surface having a surface area that is greater than a surface area of the first thermal contact surface such that the first and the second thermal contact surfaces are adapted to be mounted on the first and the second heat-generating electronic components respectively,
a number of the second pockets being greater than a number of the at least one first pocket;
when assembling the first liquid cooling assembly:
selecting at least one liquid cooling block of the plurality of liquid cooling blocks to mate with the first heat spreading base in order to form the first liquid cooling assembly suitable for cooling the first heat-generating electronic component; and
inserting the selected at least one liquid cooling block at least partly into a corresponding one of the at least one first pocket of the first heat spreading base,
the block thermal contact surface of each of the selected at least one liquid cooling block being in contact with an upper base surface of the first heat spreading base defining the corresponding one of the at least one first pocket; and
when assembling the second liquid cooling assembly:
selecting at least two liquid cooling blocks of the plurality of liquid cooling blocks to mate with the second heat spreading base in order to form the second liquid cooling assembly suitable for cooling the second heat-generating electronic component; and
inserting each of the selected at least two liquid cooling blocks at least partly into a corresponding one of the second pockets of the second heat spreading base,
the block thermal contact surface of each of the selected at least two liquid cooling blocks being in contact with an upper base surface of the second heat spreading base defining the corresponding one of the second pockets.