US 12,219,727 B2
Circuit board assembly and electronic device
Jianqiang Guo, Shenzhen (CN); Wenjun Luo, Shenzhen (CN); and Fan Yang, Shenzhen (CN)
Assigned to HONOR DEVICE CO., LTD., Shenzhen (CN)
Appl. No. 18/025,470
Filed by HONOR DEVICE CO., LTD., Shenzhen (CN)
PCT Filed Aug. 18, 2022, PCT No. PCT/CN2022/113347
§ 371(c)(1), (2) Date Mar. 9, 2023,
PCT Pub. No. WO2023/040572, PCT Pub. Date Mar. 23, 2023.
Claims priority of application No. 202111113468.8 (CN), filed on Sep. 18, 2021.
Prior Publication US 2024/0206102 A1, Jun. 20, 2024
Int. Cl. H05K 7/00 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/1422 (2013.01) 19 Claims
OG exemplary drawing
 
1. A circuit board assembly, used in an electronic device, comprising at least the following:
a frame plate, comprising a frame body and first pads, wherein the first pads are provided on the frame body;
circuit boards, each provided on one side of the frame plate, wherein the circuit board comprises a board body and second pads, the second pads are provided on the board body, and the first pads face the second pads;
support bodies, provided between the frame plate and the circuit boards, wherein the support bodies are configured to support the circuit boards, so that a predetermined spacing exists between the first pads and the second pads, the support bodies each comprise a first support portion and a second support portion, the first support portion and the second support portion are stacked along a thickness direction of the frame plate, the first support portion is connected to the frame body, and the second support portion is connected to the board body; and
solder joints, provided between the first pads and the second pads, wherein the solder joints connect the first pads to the second pads, wherein the frame body is an annular structure, and two or more support bodies are spaced along a circumferential direction of the frame body.