| CPC H05K 3/284 (2013.01) [B05D 1/62 (2013.01); H05K 2201/09872 (2013.01); H05K 2203/095 (2013.01); Y10T 428/31504 (2015.04); Y10T 428/31544 (2015.04)] | 10 Claims |
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1. A method for conformally coating an electrical assembly, the method comprising:
plasma polymerization of a first compound of formula (1) and deposition of a resulting polymer of the first compound of formula (I) onto at least one surface of an electrical assembly, the electrical assembly comprising a substrate, a substrate surface, at least one conductive track, at least one electrical component, and a bond connection between the at least one conductive track and the at least one electrical component, and
plasma polymerization of a first fluorocarbon and deposition of the resulting polymer of the first fluorocarbon onto the resulting polymer of the first compound of formula (1);
 wherein:
R1 represents C1-C3 alkyl or C2-C3 alkenyl;
R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and
R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and
wherein the resulting polymer comprising of the first compound of formula (I) has a thickness from 250 nanometers to 300 nanometers and the resulting polymer comprising of the first fluorocarbon has a thickness from 25 nanometers to 50 nanometers, wherein the polymer of the first compound of formula (I) comprises crosslinked structure and retains reactive sites, and wherein the resulting polymer is deposited onto the substrate surface, the at least one conductive track, the at least one electrical component, and the bond connection,
wherein the resulting polymer is deposited onto a top side of the electrical component and further deposited on an underside of the electrical component opposite to the top side; and
wherein the resulting polymer is deposited on the substrate below the electrical component.
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