US 12,219,715 B2
System and method for manufacturing composite board
Sungmoon Kim, Yongin-si (KR); Jinwoo Kim, Yongin-si (KR); Sanghwa Kim, Yongin-si (KR); Euidock Ryu, Yongin-si (KR); and Hyungrae Roh, Yongin-si (KR)
Assigned to DOOSAN CORPORATION, Seoul (KR)
Appl. No. 17/622,551
Filed by DOOSAN CORPORATION, Seoul (KR)
PCT Filed Jun. 25, 2020, PCT No. PCT/KR2020/008270
§ 371(c)(1), (2) Date Apr. 20, 2022,
PCT Pub. No. WO2020/262979, PCT Pub. Date Dec. 30, 2020.
Claims priority of application No. 10-2019-0075969 (KR), filed on Jun. 25, 2019.
Prior Publication US 2022/0353999 A1, Nov. 3, 2022
Int. Cl. H05K 3/28 (2006.01)
CPC H05K 3/28 (2013.01) [H05K 2203/166 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A system for manufacturing a composite board, the system comprising:
a coverlay supply apparatus configured to supply a coverlay;
a printed circuit board supply apparatus configured to supply a printed circuit board; and
a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board,
wherein the pre-bonding apparatus comprises:
a coverlay seating unit on which the coverlay supplied from the coverlay supply apparatus is seated;
a pickup transfer unit positioned to correspond to a position of the coverlay seating unit and configured to pick up the coverlay seated on the coverlay seating unit and transfer the same onto the printed circuit board supplied from the printed circuit board supply apparatus;
an aligning table unit configured to align the coverlay transferred by the pickup transfer unit onto the printed circuit board supplied from the printed circuit board supply apparatus; and
a pre-bonding unit configured to pre-bond the coverlay and the printed circuit board, which are aligned in the aligning table unit and automatically and continuously supplied from the aligning table unit,
wherein the pickup transfer unit comprises:
a pickup body part;
a transfer part configured to reciprocate the pickup body part between the coverlay seating unit and the aligning table unit; and
a pickup part supported by the pickup body part and configured to pick up the coverlay seated on the coverlay seating unit, and
wherein the pre-bonding unit comprises
a pre-bonding housing part,
an upper support part disposed inside the pre-bonding housing part and configured to move up and down,
an upper pre-bonding part mounted under the upper support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit,
a lower support part disposed inside the pre-bonding housing part to face the upper support part,
a lower pre-bonding part mounted above the lower support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit, and
a driving part configured to move the upper support part up and down.