CPC H05K 1/181 (2013.01) [H04N 23/51 (2023.01); H05K 1/111 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 2201/099 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10651 (2013.01)] | 25 Claims |
1. An electric module comprising:
a printed wiring board having:
an insulating substrate,
a first land, a second land, a third land, a fourth land, a fifth land, and a sixth land disposed on the insulating substrate, and
a solder resist film disposed on the insulating substrate and having a first opening, a second opening, and a third opening;
a first chip component having a length in a longitudinal direction and a length in a lateral direction, the first chip component having a first electrode and a second electrode disposed at end portions in the longitudinal direction;
a second chip component having a length in the longitudinal direction and a length in the lateral direction, the second chip component having a third electrode and a fourth electrode disposed at end portions in the longitudinal direction; and
a third chip component having a length in the longitudinal direction and a length in the lateral direction, the third chip component having a fifth electrode and a sixth electrode disposed at end portions in the longitudinal direction,
wherein a portion of the first land and a portion of the second land are exposed in the first opening,
wherein the first electrode connects the first land by solder,
wherein the second electrode connects the second land by solder,
wherein a portion of the third land and a portion of the fourth land are exposed in the second opening,
wherein the third electrode connects the third land by solder,
wherein the fourth electrode connects the fourth land by solder,
wherein a portion of the fifth land and a portion of the sixth land are exposed in the third opening,
wherein the fifth electrode connects the fifth land by solder,
wherein the sixth electrode connects the sixth land by solder,
wherein the longitudinal direction of the first chip component and the longitudinal direction of the second chip component are along a first direction,
wherein the lateral direction of the first chip component and the lateral direction of the third chip component are along a second direction intersecting the first direction,
wherein the solder is disposed on a side end surface of the first electrode, on a side end surface of the second electrode, on a side end surface of the third electrode, on a side end surface of the fourth electrode, on a side end surface of the fifth electrode, and on a side end surface of the sixth electrode, and
wherein a relationship of 0.894≤L1/L2 is satisfied, where L1 represents a length of the first opening in the longitudinal direction of the first chip component, a length of the second opening in the longitudinal direction of the second chip component, and a length of the third opening in the longitudinal direction of the third chip component, L2 represents a length of the first chip component in the longitudinal direction, a length of the second chip component in the longitudinal direction, and a length of the third chip component in the longitudinal direction.
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