US 12,219,711 B2
Bare circuit board
Chun-Hsien Chien, Taoyuan (TW); Hsin-Hung Lee, Taoyuan (TW); Hsuan-Yu Lai, Taoyuan (TW); Yu-Chung Hsieh, Taoyuan (TW); and Hung-Pin Yu, Taoyuan (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Jan. 17, 2023, as Appl. No. 18/155,708.
Claims priority of provisional application 63/302,135, filed on Jan. 24, 2022.
Claims priority of application No. 112100433 (TW), filed on Jan. 5, 2023.
Prior Publication US 2023/0262900 A1, Aug. 17, 2023
Int. Cl. H01Q 1/48 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/181 (2013.01) [H01Q 1/48 (2013.01); H05K 1/111 (2013.01); H05K 2201/10098 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A bare circuit board, comprising:
a substrate comprising a surface;
an antenna formed on the substrate;
a chip pad formed on the substrate;
a ground pattern formed on the surface; and
a trace formed on the surface and configured to be without connecting the ground pattern,
wherein a measuring gap is formed between the trace and an edge of the ground pattern, and the trace comprises a first end and a second end,
wherein the first end is electrically connected to the chip pad, wherein the second end is electrically connected to the antenna, and
wherein the bare circuit board is adapted to transmit a signal, and a width of the measuring gap is smaller than a quarter of an equivalent wavelength of the signal.