US 12,219,706 B2
Removable and low insertion force connector system
Jonathan W. Thibado, Beaverton, OR (US); Aaron Gorius, Upton, MA (US); Michael T. Crocker, Portland, OR (US); Matthew J. Adiletta, Bolton, MA (US); John C. Gulick, Portland, OR (US); and Emery E. Frey, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 22, 2021, as Appl. No. 17/354,989.
Application 17/354,989 is a continuation in part of application No. 17/337,342, filed on Jun. 2, 2021, granted, now 12,082,370.
Claims priority of provisional application 63/061,633, filed on Aug. 5, 2020.
Claims priority of provisional application 63/034,314, filed on Jun. 3, 2020.
Prior Publication US 2021/0400813 A1, Dec. 23, 2021
Int. Cl. H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/118 (2013.01) [H05K 1/0393 (2013.01); H05K 3/284 (2013.01); H05K 3/366 (2013.01); H05K 7/02 (2013.01); H05K 7/20236 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first circuit board comprising at least one conductor region;
a second circuit board; and
a coupling circuitry covered in an insulative material,
wherein:
the coupling circuitry comprises a flexible cable, a third circuit board, and a fourth circuit board,
melting of the at least one conductor region is to cause a conductive coupling of the at least one conductor region with the third circuit board,
the coupling circuitry is adapted to conductively couple the first circuit board oriented orthogonal to the second circuit board, and
the third circuit board and the fourth circuit board are oriented perpendicular.