US 12,219,705 B2
Flexible printed circuit board, COF module, and electronic device comprising the same
Eon Jong Lee, Seoul (KR); and Hyun Jin Lee, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Oct. 28, 2022, as Appl. No. 18/050,737.
Claims priority of application No. 10-2021-0147328 (KR), filed on Oct. 29, 2021.
Prior Publication US 2023/0135478 A1, May 4, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/117 (2013.01) [H05K 1/028 (2013.01); H05K 2201/10128 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A flexible printed circuit board comprising:
a substrate;
a circuit pattern disposed on the substrate; and
a protective layer disposed on the circuit pattern,
wherein the circuit pattern includes a first circuit pattern and a second circuit pattern,
wherein the first circuit pattern includes a first pad part, a second pad part, and a first wiring part connected to the first pad part and the second pad part,
wherein the first wiring part includes a first pattern extending in contact with the second pad part,
wherein the first pattern includes a first pattern part and a second pattern part disposed under the protective layer,
wherein the first pattern part includes an extension area having a width greater than that of the second pattern part,
wherein a maximum width of the first pattern part is greater than a maximum width of the second pad part.