US 12,219,703 B2
Printed circuit board
Jonghyun Seok, Seoul (KR); and Kyeongseon Park, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Nov. 7, 2023, as Appl. No. 18/503,974.
Application 18/503,974 is a continuation of application No. 17/672,979, filed on Feb. 16, 2022, granted, now 11,844,176.
Claims priority of application No. 10-2021-0082387 (KR), filed on Jun. 24, 2021; and application No. 10-2021-0132221 (KR), filed on Oct. 6, 2021.
Prior Publication US 2024/0074051 A1, Feb. 29, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 2201/09409 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a base substrate having a first side and a second side, extending in a first direction and parallel to each other, and a third side and a fourth side extending in a second direction, perpendicular to the first direction, and parallel to each other;
a first pad region having a first edge region adjacent to an intersection of the first side and the third side, and first sub-pad regions separated from the first edge region disposed on one surface of the base substrate;
a second pad region having a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate and second sub-pad regions separated from the second edge region disposed on the one surface of the base substrate; and
a dummy region having a third edge region adjacent to an intersection of the first side and the fourth side, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.