US 12,219,702 B2
Wiring substrate and display device
Kenichi Takemasa, Tokyo (JP); and Yasushi Nakano, Tokyo (JP)
Assigned to JAPAN DISPLAY INC., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Sep. 9, 2022, as Appl. No. 17/941,761.
Application 17/941,761 is a continuation of application No. PCT/JP2021/001597, filed on Jan. 19, 2021.
Claims priority of application No. 2020-052849 (JP), filed on Mar. 24, 2020.
Prior Publication US 2023/0007770 A1, Jan. 5, 2023
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 2201/10106 (2013.01); H05K 2201/10128 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wiring substrate comprising:
a substrate;
an insulating film stacked on the substrate;
an anode pad stacked on a first surface of the insulating film and electrically coupled to an anode of an inorganic light-emitting diode;
a cathode pad stacked on the first surface of the insulating film and electrically coupled to a cathode of the inorganic light-emitting diode; and
an auxiliary pad provided to the first surface of the insulating film and having electrical conductivity,
wherein
the auxiliary pad is disposed in a floating state near an end of the anode pad and the cathode pad,
the auxiliary pad crushed, when being melted, by the anode or the cathode to expand in a planar direction parallel to the first surface of the insulating film, and an amount of expansion in the planar direction is a first expansion amount, and
a distance between the auxiliary pad and the anode pad or the cathode pad disposed adjacently to the auxiliary pad in the planar direction and a distance between the auxiliary pad and another auxiliary pad disposed adjacently to the auxiliary pad in the planar direction are smaller than the first expansion amount.