US 12,219,701 B2
Component carrier
Abderrazzaq Ifis, Leoben (AT); and Reinhard Opitz, Leoben (AT)
Assigned to AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Apr. 21, 2022, as Appl. No. 17/660,168.
Claims priority of application No. 21170109 (EP), filed on Apr. 23, 2021.
Prior Publication US 2022/0346229 A1, Oct. 27, 2022
Int. Cl. H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0353 (2013.01) [H05K 1/0298 (2013.01); H05K 3/4673 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A component carrier, comprising:
a base structure having a main surface with a surface profile;
a first dielectric layer formed on the main surface of the base structure and having a first main surface with a first surface profile,
wherein the first main surface faces away from the main surface of the base structure, and
wherein the first surface profile corresponds to the surface profile of the base structure; and
a second dielectric layer formed on the first main surface and having a second main surface with a second surface profile,
wherein the second main surface faces away from the main surface of the base structure, and
wherein the second surface profile differs from the surface profile of the base structure;
wherein first process conditions of a first lamination process and second process conditions of a second lamination process are selected such that height variations of the second surface profile are significantly smaller than respective height variations of the first surface profile.