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1. A circuit board comprising: a first insulating layer; a first circuit pattern disposed on and under the first insulating layer; a first via passing through the first insulating layer; a second insulating layer disposed on the first insulating layer; a second circuit pattern disposed on the second insulating layer; a second via passing through the second insulating layer; a third insulating layer disposed under the first insulating layer; a third circuit pattern disposed under the third insulating layer; and a third via passing through the third insulating layer; wherein the first insulating layer is provided with an insulating material including glass fibers, wherein each of the second insulating layer and the third insulating layer is provided with an insulating material that does not include a glass fiber, wherein each thickness of the second insulating layer and the third insulating layer is smaller than a thickness of layers of the first insulating layer, wherein a thickness of the first via is greater than a thickness of each of the first circuit patterns; wherein a thickness of the second via is smaller than a thickness of the second circuit pattern; and wherein a thickness of the third via is smaller than a thickness of the third circuit pattern.
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