US 12,219,699 B2
Flexible circuit board, COF module, and electronic device comprising the same
Seung Soo Cho, Seoul (KR); Hyung Kyu Yoon, Seoul (KR); and Sung Min Chae, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Jan. 9, 2023, as Appl. No. 18/151,698.
Claims priority of application No. 10-2022-0002989 (KR), filed on Jan. 7, 2022.
Prior Publication US 2023/0225048 A1, Jul. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0296 (2013.01) [H05K 1/028 (2013.01); H05K 1/115 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flexible circuit board comprising:
a substrate on which a chip mounting area is defined;
a circuit pattern disposed on the substrate; and
a protective layer on the circuit pattern,
wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of dummy patterns,
wherein each first circuit pattern includes a first pad part, a second pad part, and a first wiring part connected to the first pad part and the second pad part,
wherein each second circuit pattern includes a third pad part, a fourth pad part, and a second wiring part connected to the third pad part and the fourth pad part,
wherein a through hole is disposed in an inner region of each first circuit pattern.