US 12,219,698 B2
Printed circuit board dielectric molding, machining and electrolytic metallization
Edward C. Carignan, Round Rock, TX (US); and Paulo Guedes-Pinto, Round Rock, TX (US)
Assigned to INFINITUM ELECTRIC INC., Round Rock, TX (US)
Filed by INFINITUM ELECTRIC, INC., Round Rock, TX (US)
Filed on Oct. 23, 2023, as Appl. No. 18/382,921.
Application 18/382,921 is a continuation of application No. 18/127,453, filed on Mar. 28, 2023, granted, now 11,800,640.
Prior Publication US 2024/0334594 A1, Oct. 3, 2024
Int. Cl. H05K 1/02 (2006.01); H02K 3/26 (2006.01); H05K 1/03 (2006.01); H05K 3/18 (2006.01)
CPC H05K 1/0284 (2013.01) [H02K 3/26 (2013.01); H05K 1/0366 (2013.01); H05K 3/18 (2013.01); H05K 2201/09036 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB), comprising:
a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer;
each side comprises channels and pockets formed by machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB;
the channels and pockets in a same side of the 3D dielectric substrate have a uniform depth;
side walls of the channels and pockets have a draft angle in a range of greater than 0 degrees to about 5 degrees;
the conductive traces and pads are formed into the channels and pockets by electrolytic metallization; and
the outer surface of conductive traces and pads are flush with the sides of the 3D dielectric substrate.