	US 12,219,695 B2
	Circuit board and manufacturing method thereof, and terminal device
Junjie Yang, Shenzhen (CN); Erliang Li, Shenzhen (CN); Jian Bai, Shenzhen (CN); and Xiaohang Li, Shenzhen (CN)
Assigned to HONOR DEVICE CO., LTD., Shenzhen (CN)
Appl. No. 18/041,767
Filed by Honor Device Co., Ltd., Shenzhen (CN)
PCT Filed Aug. 26, 2022, PCT No. PCT/CN2022/115228 § 371(c)(1), (2) Date Feb. 15, 2023, PCT Pub. No. WO2023/071486, PCT Pub. Date May 4, 2023.
Claims priority of application No. 202111258940.7 (CN), filed on Oct. 27, 2021.
Prior Publication US 2024/0138056 A1, Apr. 25, 2024 Prior Publication US 2024/0237194 A9, Jul. 11, 2024
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 9/00 (2006.01)

CPC H05K 1/0268 (2013.01) [H05K 1/116 (2013.01); H05K 3/3485 (2020.08); H05K 9/0024 (2013.01); H05K 2201/035 (2013.01)]

20 Claims

1. A circuit board, comprising:

a substrate including a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, wherein the pad group comprises a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and

a liquid metal body arranged at a position of the pad group and connecting the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit.