US 12,219,693 B2
Carrier structure
Chin-Wei Hsu, Taichung (TW); Jui-Kun Wang, Taichung (TW); Shu-Yu Ko, Taichung (TW); Fang-Wei Chang, Taichung (TW); and Hsiu-Fang Chien, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Nov. 2, 2022, as Appl. No. 17/979,262.
Claims priority of application No. 111129375 (TW), filed on Aug. 4, 2022.
Prior Publication US 2024/0049382 A1, Feb. 8, 2024
Int. Cl. H05K 1/02 (2006.01); H01L 23/544 (2006.01); H05K 3/00 (2006.01)
CPC H05K 1/0266 (2013.01) [H01L 23/544 (2013.01); H05K 3/0008 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H05K 2203/166 (2013.01); H05K 2203/167 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A carrier structure being defined with a main area and a peripheral area adjacent to the main area, the carrier structure comprising:
a plurality of packaging substrates disposed in the main area;
a plurality of positioning holes disposed in the peripheral area; and
a plurality of positioning traces disposed in the peripheral area and arranged along a part of edges of the plurality of positioning holes.