US 12,219,691 B2
Printed circuit board assembly with integrated vapor chamber
David Haley, Beaverton, OR (US); James Stephen Fields, Jr., Santa Fe, NM (US); and Seungkug Park, San Jose, CA (US)
Assigned to NVIDIA CORPORATION, Santa Clara, CA (US)
Filed by NVIDIA CORPORATION, Santa Clara, CA (US)
Filed on Apr. 25, 2022, as Appl. No. 17/728,731.
Prior Publication US 2023/0345613 A1, Oct. 26, 2023
Int. Cl. H05K 1/02 (2006.01); G06F 1/20 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0203 (2013.01) [G06F 1/20 (2013.01); H05K 1/181 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A printed circuit board assembly, comprising:
a printed circuit board (PCB);
an integrated circuit (IC) package that is mounted on the PCB and includes an exposed surface and a bare IC die disposed on the exposed surface;
an additional IC package that is mounted on the PCB and includes an additional surface; and
a vapor chamber has that includes a first surface that is coupled to the exposed surface of the IC package and a second surface that is coupled to the additional surface of the additional IC package, wherein the vapor chamber further includes a first evaporator region that is adjacent to the first surface and a second evaporator region that is adjacent to the second surface.